MICRO DICING SERVICES

Your Complete Sawing Solution

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780 Montague Expressway, Suite 303
San Jose, CA 95131

(408) 321-8840

Micro Dicing Services provides Sawing Services to the microelectronic and the optical industry.  Our specialty is in processing hard to cut and brittle materials.  We offer a full in-house production and research facility.  Our core expertise in Dicing, Cutting and Sawing services offers you a complete solution for your R&D and production needs.  We can produce custom blades for dicing your specific materials.  Our fulltime staff includes a Ph. D. and engineers with years of experience in the handling of various materials.

 


SCOPE OF OFFERINGS:

  • Precision Dicing and Sawing
  • Dicing Consultation
  • Pick and Place Service
  • Thinning, Grinding and Polishing
  • Custom Dicing Blades
  • Quick Turnaround Services

 

 


MATERIALS THAT WE PROCESS: (partial list)

  • IC - Silicon, Gallium Arsenide, MEMS, LED
  • Glass and Ceramics - Quartz, Pyrex, SiC, TiC, PZT, Alumina
  • Crystals - Sapphire, Ruby, YAG, Zirconia, Lithium Niobate, Lithium Tantalate, Garnet
  • Substrates - Solar Cells, Multi-layer Boards, FR4, Plastic, bonded materials
  • Metals - Ag, Al, Cu, W, Mo, Kovar
  • Shapes - Tubes, Coils, Cylinders

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780 Montague Expressway, Suite 303, San Jose, CA 95131 Tel: (408) 321-8840  Fax: (408) 321-8843