MICRO DICING SERVICES

780 Montague Expressway, Suite 303
San Jose, CA 95131

Micro Dicing Services provides Sawing Services to the microelectronic and the optical industry.  Our specialty is in processing hard to cut and brittle materials.  We offer a full in-house production and research facility.  Our core expertise in Dicing, Cutting and Sawing services offers you a complete solution for your R&D and production needs.  We can produce custom blades for dicing your specific materials.  Our fulltime staff includes a Ph. D. and engineers with years of experience in the handling of various materials.

SCOPE OF OFFERINGS:

• Precision Dicing and Sawing
• Dicing Consultation
• Pick and Place Service
• Thinning, Grinding and Polishing
• Custom Dicing Blades
• Quick Turnaround Services

MATERIALS THAT WE PROCESS: (partial list)

• IC - Silicon, Gallium Arsenide, MEMS, LED
• Glass and Ceramics - Quartz, Pyrex, SiC, TiC, PZT, Alumina
• Crystals - Sapphire, Ruby, YAG, Zirconia, Lithium Niobate, GaN, Lithium Tantalate, Garnet
• Substrates - Solar Cells, Multi-layer Boards, FR4, Plastic, bonded materials
• Metals - Ag, Al, Cu, W, Mo, Kovar
• Shapes - Tubes, Coils, Cylinders

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